Laser Scribing Ceramic Substrates

The process involves pulsing a co2 laser through an optical configuration through a focusing lens focusing the beam through an air assisted nozzle assembly and finally onto the substrate s work surface.

Laser scribing ceramic substrates.

Laser cutting takes longer than scribing because the laser is cutting com pletely through the substrate which likely also increases fabrication cost. That is because more power is required to com. Selection depends on ceramic type economical advantages for users. Nevertheless feature size and finish quality of the ceramic substrates used for electronics applications.

Remote internet monitoring and. Laser scribing ceramic substrates has been increasingly popular since its introduction to the industry nearly 50 years ago. Substrate materials size thickness lapping polishing laser machining scribing annealing coorstek is the leader in custom and standard thin film ceramic substrates. Laser processing service for ceramic substrate 1 laser cutting scribing and drilling service for ceramic substrate.

2 leatec provide the design laser express and surface treatment consultation service. One for cutting and one for scribing als200 lasers are offered as basic system with manual loading unloading or with. System can be equipped with co2 laser and innovative fiber laser for better precision and higher edge quality. Laser scribing is a technique that allows for easy singulation of ceramic substrates circuits from a manufacturing panel sheet.

The system is equipped with double nozzle for an e automatic switching. This is the best way to ensure precise and clean milling and drilling of the ceramic. Laser scribing is drilling a series of blind holes in a line to create a weak spot in the material and ensure a clean cut when breaking out. How are the ceramic substrates machined.

Reduced space for laser scribing plug n play characteristics give the system ease of installation and quick start up times. As opposed to laser cutting the laser beam does not go all the way through the material during a laser scribing process and the goal is to make a perforated line along which an easy and clean break out can be done. Als200 is a very high accuracy laser system that is designed for scribing drilling and cutting of ceramic substrates for thin and thick film hybrid circuits up to 6 x6 typical al 2 o 3 and aln. Four thin film substrate material options combine smooth surface finish strong flexural strength and consistent electrical properties.

Substrate materials size thickness laser machining laser scribing edge finishing design guides coorstek developed the standards for thick film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits surface mount devices sensors and other thick film electronics. View pdf view pdf in german scribing and micromachining of aln and al2o3 ceramics has been dominated by the use of co2 lasers for 30 years the simple reason being that the 10 6 μm wavelength has been the best suited to processing these types of materials. Yield i e the number of parts that come from a single ceramic sheet is also lower with cutting.